NAND-based MCP

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NAND-based MCP
The Longsys MCP component comes with JEDEC standard ballout. It integrates SLC NAND Flash with LPDRAM inside one small-footprint package. Its compact size and low power consumption make it an ideal memory solution for many IoT and wearable applications. MCP with an industrial operating temperature range (-40°C~85°C) is also available.